Invention Grant
- Patent Title: Microphone assembly and electronic device comprising a microphone assembly
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Application No.: US16495293Application Date: 2017-03-21
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Publication No.: US10999683B2Publication Date: 2021-05-04
- Inventor: Jouni Tapio Mäki , Juuso Heiskanen
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Rimon PC
- International Application: PCT/EP2017/056706 WO 20170321
- International Announcement: WO2018/171870 WO 20180927
- Main IPC: H04R19/04
- IPC: H04R19/04 ; B81B7/00 ; H04R1/04 ; H04R3/00 ; H04R19/00

Abstract:
A microphone assembly comprising a microphone unit secured to a mounting element. The microphone unit has a first side comprising an audio port, and the mounting element comprises a rigid body having a mounting side. The first side of the microphone unit is arranged at a right angle to the mounting side of the mounting element. The microphone unit may comprise a micro electromechanical systems (MEMS) microphone package holding a MEMS microphone die, and the mounting side of the mounting element may be configured for being mounted or soldered to a printed circuit board. The microphone assembly may be mounted to a device printed circuit board.
Public/Granted literature
- US20200037081A1 MICROPHONE ASSEMBLY AND ELECTRONIC DEVICE COMPRISING A MICROPHONE ASSEMBLY Public/Granted day:2020-01-30
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