- Patent Title: Monolithic die with acoustic wave resonators and active circuitry
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Application No.: US16550673Application Date: 2019-08-26
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Publication No.: US10998879B2Publication Date: 2021-05-04
- Inventor: Telesphor Kamgaing , Georgios Dogiamis , Feras Eid , Aleksandar Aleksov , Johanna M. Swan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H03H9/08
- IPC: H03H9/08 ; H03H9/05 ; H03H9/54 ; H03H9/70 ; H03H3/02 ; H01L23/367 ; H01L23/498 ; H01L23/552 ; H01L23/00 ; H01L25/16 ; H01L27/20 ; H01L23/66
Abstract:
Embodiments may relate to a radio frequency (RF) front-end module (FEM). The RF FEM may include an integrated die with an active portion and an acoustic wave resonator (AWR) portion adjacent to the active portion. The RF FEM may further include a lid coupled with the die. The lid may at least partially overlap the AWR portion at a surface of the die. Other embodiments may be described or claimed.
Public/Granted literature
- US20210067132A1 MONOLITHIC DIE WITH ACOUSTIC WAVE RESONATORS AND ACTIVE CIRCUITRY Public/Granted day:2021-03-04
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