Invention Grant
- Patent Title: Semiconductor laser device, manufacturing method thereof, and light emitting device
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Application No.: US16237323Application Date: 2018-12-31
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Publication No.: US10998695B2Publication Date: 2021-05-04
- Inventor: Toshiyuki Kawakami , Masayuki Ohta , Ryota Kawamura
- Applicant: SHARP KABUSHIKI KAISHA
- Applicant Address: JP Sakai
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Sakai
- Agency: ScienBiziP, P.C.
- Priority: JPJP2018-006496 20180118
- Main IPC: H01S5/028
- IPC: H01S5/028 ; H01S5/10 ; H01S5/22 ; H01S5/24 ; H01S5/042 ; H01S5/40 ; H01S5/02 ; H01S5/02216 ; H01S5/16 ; H01S5/02253

Abstract:
A semiconductor laser device includes an optical waveguide that extends toward a first end of the semiconductor laser device. The optical waveguide includes a first clad layer, an active layer, a second clad layer, and an electrode layer in this order. A reflecting surface, which has a dielectric film and a metal film in this order from the active layer, crosses the active layer at a second end of the optical waveguide.
Public/Granted literature
- US20190221999A1 SEMICONDUCTOR LASER DEVICE, MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING DEVICE Public/Granted day:2019-07-18
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