Invention Grant
- Patent Title: Electrical assembly
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Application No.: US16623492Application Date: 2018-06-14
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Publication No.: US10998656B2Publication Date: 2021-05-04
- Inventor: Bernd-Guenter Sippel , Peter Zweigle , Helmut Deringer , Franco Zeleny , Uwe Katzenwadel , Jens Hoffmann
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Maginot, Moore & Beck LLP
- Priority: DE102017212796.1 20170726
- International Application: PCT/EP2018/065890 WO 20180614
- International Announcement: WO2019/020272 WO 20190131
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H01R12/70 ; H01R13/24 ; H01R13/504 ; H05K1/18

Abstract:
An electrical assembly for a motor vehicle transmission includes a printed circuit board (PCB), at least two contact surfaces, at least two contact elements, and a potting compound. The PCB has a component side and the two contact surfaces are arranged on the component side. The contact elements are each electrically connected by a PCB-side first end portion to one of the contact surfaces. The potting compound is arranged on the component side of the PCB, and the contact elements are partly embedded therein. The potting compound directly contacts the contact surfaces and the PCB-side end portions of the contact elements and covers the same. The contact elements protrude from the potting compound by second end portions facing away from the PCB. The electrical assembly includes a chip protection frame that protrudes outward from the potting compound and forms contact chambers for the second end portions of the contact elements.
Information query