Embodiments are provided for a packaged semiconductor device including: a semiconductor die having an active side and an opposite back side, the semiconductor die including a magnetoresistive random access memory (MRAM) cell array formed within an MRAM area on the active side of the semiconductor die; and a top cover including a soft-magnetic material positioned on the back side of the semiconductor die, wherein the top cover includes a recess formed in a first major surface of the top cover, the first major surface faces the back side of the semiconductor die, and the recess is positioned over the MRAM cell array.