Invention Grant
- Patent Title: ESD protection diode
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Application No.: US16558911Application Date: 2019-09-03
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Publication No.: US10998451B2Publication Date: 2021-05-04
- Inventor: Hideaki Sai
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: White & Case LLP
- Priority: JPJP2019-026009 20190215
- Main IPC: H01L23/62
- IPC: H01L23/62 ; H01L29/861 ; H01L29/06 ; H01L27/02 ; H01L23/552

Abstract:
A semiconductor device according to an embodiment includes a semiconductor layer that has first and second plane and includes first-conductivity-type first semiconductor region, second-conductivity-type second semiconductor region between the first semiconductor region and the first plane, first-conductivity-type third semiconductor region between the second semiconductor region and the first plane and has a lower first-conductivity-type impurity concentration than the first semiconductor region, and second-conductivity-type fourth semiconductor region between the third semiconductor region and the first plane and has a higher second-conductivity-type impurity concentration than the second semiconductor region; a first electrode on a side of the first plane of the semiconductor layer and is electrically connected to the third semiconductor region and the fourth semiconductor region; and a second electrode on a side of the second plane of the semiconductor layer, is electrically connected to the first semiconductor region, and is not electrically connected to the second semiconductor region.
Public/Granted literature
- US20200266303A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-08-20
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