Invention Grant
- Patent Title: Semiconductor structure and manufacturing method of the same
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Application No.: US16884883Application Date: 2020-05-27
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Publication No.: US10998377B2Publication Date: 2021-05-04
- Inventor: Harry-Hak-Lay Chuang , Sheng-Huang Huang , Keng-Ming Kuo , Hung Cho Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L27/22
- IPC: H01L27/22 ; H01L43/12 ; H01L43/08 ; H01L43/02

Abstract:
The present disclosure provides a semiconductor structure, including a memory region, a first metal line in the memory region, a magnetic tunneling junction (MTJ) cell over the first metal line, a carbon-based layer between the first metal line and the MTJ cell, a second metal line over the MTJ cell, a logic region adjacent to the memory region, wherein the logic region is free from a coverage of the carbon-based layer.
Public/Granted literature
- US20200286952A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2020-09-10
Information query
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