Invention Grant
- Patent Title: Conductive line patterning
-
Application No.: US16390598Application Date: 2019-04-22
-
Publication No.: US10998304B2Publication Date: 2021-05-04
- Inventor: Ru-Gun Liu , Tung-Heng Hsieh , Tsung-Chieh Tsai , Juing-Yi Wu , Liang-Yao Lee , Jyh-Kang Ting
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L21/768 ; H01L23/528 ; H01L23/522 ; H01L23/532 ; G06F30/394 ; H01L21/3213 ; H01L27/118

Abstract:
A conductive line structure includes two conductive lines in a layout. The two cut lines are over at least a part of the two conductive lines in the layout. The cut lines designate cut sections of the two conductive lines and the cut lines are spaced from each other within a fabrication process limit. The two cut lines are connected in the layout. The two conductive lines are patterned over a substrate in a physical integrated circuit using the two connected parallel cut lines. The two conductive lines are electrically conductive.
Public/Granted literature
- US20190244950A1 Conductive Line Patterning Public/Granted day:2019-08-08
Information query
IPC分类: