Invention Grant
- Patent Title: Code pattern for representing tracing number of chip
-
Application No.: US16257136Application Date: 2019-01-25
-
Publication No.: US10998285B2Publication Date: 2021-05-04
- Inventor: Chien-Chan Yeh , Ying-Chih Kuo
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L23/00 ; H01L23/31 ; H01L23/544
Abstract:
A chip comprises a semiconductor substrate having a first side and a second side opposite to the first side, a plurality of conductive metal patterns formed on the first side of the semiconductor substrate, a plurality of solder balls formed on the first side of the semiconductor substrate, and at least one code pattern of a first group and at least one code pattern of a second group formed on the first side of the semiconductor substrate in a space free from the plurality of conductive metal patterns and the plurality of solder balls, wherein the code patterns are visible from a backside of the chip, and wherein a tracing number of the chip is represented by the code patterns.
Public/Granted literature
- US20200243472A1 CODE PATTERN FOR REPRESENTING TRACING NUMBER OF CHIP Public/Granted day:2020-07-30
Information query
IPC分类:
