Invention Grant
- Patent Title: Substrate processing apparatus
-
Application No.: US16131973Application Date: 2018-09-14
-
Publication No.: US10998210B2Publication Date: 2021-05-04
- Inventor: Kazuhito Saito , Tsukasa Yashima
- Applicant: KOKUSAI ELECTRIC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe Koenig
- Priority: JPJP2016-077997 20160408
- Main IPC: H01L21/67
- IPC: H01L21/67

Abstract:
A configuration that maintains productivity and can automatically execute and control recipes includes a process chamber that processes a substrate, a first transfer chamber in which the substrate is transferred in a vacuum state, a second transfer chamber in which the substrate is transferred in an atmospheric pressure state, a depressurizable preparatory chamber connecting the first transfer chamber and the second transfer chamber, and a controller that executes a maintenance recipe in the preparatory chamber and a production recipe in the process chamber, respectively, in which, when the controller receives an instruction for executing the production recipe during execution of the maintenance recipe, the controller temporarily stops the maintenance recipe and preferentially executes the production recipe, and continuously executes the temporarily stopped maintenance recipe, after completion of the production recipe.
Public/Granted literature
- US20190013223A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2019-01-10
Information query
IPC分类: