Invention Grant
- Patent Title: Substrate processing platforms including multiple processing chambers
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Application No.: US16427642Application Date: 2019-05-31
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Publication No.: US10998209B2Publication Date: 2021-05-04
- Inventor: Thomas Brezoczky , Kirankumar Neelasandra Savandaiah , Srinivasa Rao Yedla
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B65G29/00 ; H01L21/687

Abstract:
Methods and apparatus for substrate processing are provided herein. The apparatus, for example, can include a plurality of multi environment chambers coupled to a buffer chamber configured to load a substrate therefrom into each of the plurality of multi environment chambers for processing of the substrate using a plurality of processing mini environment chambers coupled to each of the plurality of multi environment chambers, at least one of the plurality of multi environment chambers comprising a robot and at least one of the plurality of multi environment chambers comprising a carousel, wherein each of the robot and the carousel is configured to transfer the substrate to and from each of the processing mini environment chamber of the plurality of processing mini environment chambers.
Public/Granted literature
- US20200381275A1 SUBSTRATE PROCESSING PLATFORMS INCLUDING MULTIPLE PROCESSING CHAMBERS Public/Granted day:2020-12-03
Information query
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