Invention Grant
- Patent Title: Peeling method for peeling off substrate from support plate
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Application No.: US16281872Application Date: 2019-02-21
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Publication No.: US10998196B2Publication Date: 2021-05-04
- Inventor: Katsuhiko Suzuki
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JPJP2018-033502 20180227
- Main IPC: H01L21/304
- IPC: H01L21/304 ; H01L21/78 ; H01L21/683 ; H01L21/56
Abstract:
A peeling method for peeling off a substrate provided over a support plate through a peel layer from the support plate includes: a first holding step of holding one of the support plate and the substrate by a first holding unit; a start point region forming step of blowing a fluid to an end portion of the peel layer exposed at an end portion of the support plate and the substrate, to form a start point region which will serve as a start point when peeling off the substrate from the support plate; a second holding step of holding the other of the support plate and the substrate by a second holding unit; and a peeling step of relatively moving the first holding unit and the second holding unit in directions for spacing away from each other, to peel off the substrate from the support plate.
Public/Granted literature
- US20190267245A1 PEELING METHOD FOR PEELING OFF SUBSTRATE FROM SUPPORT PLATE Public/Granted day:2019-08-29
Information query
IPC分类:
