Invention Grant
- Patent Title: Structure stamp, device and method for embossing
-
Application No.: US16528717Application Date: 2019-08-01
-
Publication No.: US10994470B2Publication Date: 2021-05-04
- Inventor: Peter Fischer , Gerald Kreindl , Jakob Harming , Christine Thanner , Christian Schon
- Applicant: EV GROUP E. THALLNER GMBH
- Applicant Address: AT St. Florian am Inn
- Assignee: EV GROUP E. THALLNER GMBH
- Current Assignee: EV GROUP E. THALLNER GMBH
- Current Assignee Address: AT St. Florian am Inn
- Agency: Kusner & Jaffe
- Main IPC: B29C59/02
- IPC: B29C59/02 ; B29C59/00 ; G03F7/00 ; B82Y10/00 ; B82Y40/00

Abstract:
A structure stamp has a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, and an embossing element drive for moving an embossing element along the structure stamp.
Public/Granted literature
- US20190351606A1 STRUCTURE STAMP, DEVICE AND METHOD FOR EMBOSSING Public/Granted day:2019-11-21
Information query