Invention Grant
- Patent Title: Heat dissipation plate assembly, display module and its assembling method
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Application No.: US16906693Application Date: 2020-06-19
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Publication No.: US10973155B2Publication Date: 2021-04-06
- Inventor: Yang Gao , Shuquan Yang , Qiang He , Chao Yang , Yang Yang , Mengyuan Pang
- Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Sichuan; CN Beijing
- Assignee: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Sichuan; CN Beijing
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201910753736.9 20190815
- Main IPC: H01L23/40
- IPC: H01L23/40 ; B23K1/00 ; H05K7/20 ; G09F9/30

Abstract:
A display substrate includes a first region, a second region, and a bendable region between the first region and the second region, and a heat dissipation plate assembly for heat dissipation of the display substrate includes: a first release film; a heat dissipation plate, comprising a first portion and a second portion which are separated by a space and located on the first release film; a protective film, located on a side of the heat dissipation plate distal to the first release film, having a substantially same shape as the heat dissipation plate, and comprising a third portion located on the first portion and a fourth portion located on the second portion, the third portion being able to be bonded to the first region of the display substrate, and the fourth portion being able to be bonded to the second region of the display substrate; and a second release film, located on a side of the protective film distal to the heat dissipation plate and having a substantially same shape as the first release film.
Public/Granted literature
- US20210051822A1 HEAT DISSIPATION PLATE ASSEMBLY, DISPLAY MODULE AND ITS ASSEMBLING METHOD Public/Granted day:2021-02-18
Information query
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