Invention Grant
- Patent Title: Circuit device, method for manufacturing circuit device and connector
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Application No.: US16630138Application Date: 2018-06-26
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Publication No.: US10973137B2Publication Date: 2021-04-06
- Inventor: Hirokazu Komori , Naomichi Kawashima , Hiroki Hirai , Makoto Higashikozono , Masanori Moriyasu
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Mie; JP Mie; JP Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Mie; JP Mie; JP Osaka
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JPJP2017-135952 20170712
- International Application: PCT/JP2018/024097 WO 20180626
- International Announcement: WO2019/012977 WO 20190117
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H01R13/50 ; H05K3/28 ; H05K1/18

Abstract:
An ECU 1 includes a circuit board 10, a connector 20 fixed to the circuit board 10 and a resin portion 50 covering the circuit board 10 and the connector 20. The connector 20 includes a housing body 22 and a cut-off receiving portion 27 projecting from the housing body 22. The cut-off receiving portion 27 includes a flange portion 28 projecting outward from the housing body 22 and a flexible wall 29 extending from the flange portion 28 and inclined to be closer to the housing body 22 toward a tip, and a part of the flexible wall 29 is embedded in the resin portion 50.
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