Invention Grant
- Patent Title: Printed wiring board
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Application No.: US16415458Application Date: 2019-05-17
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Publication No.: US10973130B2Publication Date: 2021-04-06
- Inventor: Shinichirou Hayashi
- Applicant: FANUC CORPORATION
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Fredriksen & Byron, P.A.
- Priority: JPJP2018-098044 20180522
- Main IPC: H05K3/34
- IPC: H05K3/34
Abstract:
A printed wiring board includes a substrate, a contact member arranged in contact with the substrate, and a wear resistant member fixed at least in an area on the substrate that comes in contact with the contact member, the wear resistant member having a wear resistance higher than that of the substrate.
Information query
