- Patent Title: Differential signal traces including a solder mask disposed thereon
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Application No.: US16509314Application Date: 2019-07-11
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Publication No.: US10973117B2Publication Date: 2021-04-06
- Inventor: Benjamin Reed Staudt
- Applicant: FCI USA LLC
- Applicant Address: US PA Etters
- Assignee: FCI USA LLC
- Current Assignee: FCI USA LLC
- Current Assignee Address: US PA Etters
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01P11/00 ; H01L23/498 ; H01P3/08 ; H05K3/10 ; H05K3/28 ; H05K3/34
Abstract:
Disclosed herein is a method. A first electrically conductive trace is provided on a substrate. A second electrically conductive trace is providing on the substrate proximate the first electrically conductive trace. A solder mask is provided at the first and the second electrically conductive traces. A portion of the first electrically conductive trace is free of any portion of the solder mask covering thereon.
Public/Granted literature
- US20190335578A1 DIFFERENTIAL SIGNAL TRACES Public/Granted day:2019-10-31
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