Invention Grant
- Patent Title: Head band structure of headset
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Application No.: US16706896Application Date: 2019-12-09
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Publication No.: US10972839B2Publication Date: 2021-04-06
- Inventor: Chi Ming Tseng , Chin Chung Lin
- Applicant: Cheng Uei Precision Industry Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Lin & Associates Intellectual Property, Inc.
- Priority: CN201921328204.2 20190815
- Main IPC: H04R5/033
- IPC: H04R5/033 ; H04R1/10

Abstract:
A head band structure of headset includes a retractable adjusting block and a head band group. The retractable adjusting block includes an upper cover, a sliding slice, an elastic piece and a lower cover. The sliding slice has at least one blocking portion. A substantial middle of the elastic piece is arched upward to form a convex surface. The head band group is connected with the retractable adjusting block. The head band group has a head band, and two end covers disposed to two opposite ends of the head band. A surface of each end cover has a waveform locking portion, and at least one stopping frame disposed at one end of the waveform locking portion. The convex surface keeps contacting with the waveform locking portion.
Public/Granted literature
- US20210051408A1 HEAD BAND STRUCTURE OF HEADSET Public/Granted day:2021-02-18
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