Invention Grant
- Patent Title: MEMS microphone system with low pressure gap and back volume
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Application No.: US16600728Application Date: 2019-10-14
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Publication No.: US10972821B2Publication Date: 2021-04-06
- Inventor: Daniel Meisel , Andrew Doller
- Applicant: Akustica, Inc. , Robert Bosch GmbH
- Applicant Address: US PA Pittsburgh; DE Stuttgart
- Assignee: Akustica, Inc.,Robert Bosch GmbH
- Current Assignee: Akustica, Inc.,Robert Bosch GmbH
- Current Assignee Address: US PA Pittsburgh; DE Stuttgart
- Agency: Maginot, Moore & Beck LLP
- Main IPC: H04R1/04
- IPC: H04R1/04 ; B81B7/00 ; B81B7/02

Abstract:
A MEMS microphone system comprises a transducer die having a pierce-less diaphragm and a motion sensor suspended from the diaphragm. The system further comprises a housing and the diaphragm divided a volume inside the housing into a front volume and a back volume. The motion sensor suspended from the diaphragm is located in the back volume having a gas pressure that is substantially equal or lower than an ambient pressure.
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