Invention Grant
- Patent Title: Circuit assembly
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Application No.: US16351041Application Date: 2019-03-12
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Publication No.: US10971914B2Publication Date: 2021-04-06
- Inventor: Yuki Fujimura , Ryoya Okamoto , Hiroshi Shimizu
- Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Mie; JP Mie; JP Osaka
- Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Mie; JP Mie; JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2018-055952 20180323
- Main IPC: H02G5/10
- IPC: H02G5/10 ; H05K7/20

Abstract:
The heat dissipation of a circuit assembly is improved. A circuit assembly includes: a relay that includes a terminal and generates heat when energized/as a result of energization/due to being energized; a base member to which the relay is attached and in which a through hole is formed; a heat dissipation member that is provided on a side of the base member opposite to a side on which the relay is attached; a first busbar that is connected to the terminal of the relay at a position spaced apart from the base member; and a heat transfer member that is inserted into the through hole so as to be movable in a direction along the axial direction of the through hole, and that comes into contact with the first busbar and the heat dissipation member.
Public/Granted literature
- US20190297720A1 CIRCUIT ASSEMBLY Public/Granted day:2019-09-26
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