Invention Grant
- Patent Title: Antenna module and method of manufacturing the same
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Application No.: US15994514Application Date: 2018-05-31
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Publication No.: US10971825B2Publication Date: 2021-04-06
- Inventor: Ho Kyung Kang , ThomasA Kim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2017-0096349 20170728,KR10-2017-0122447 20170922
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q21/06 ; H01Q1/38 ; H01L23/498 ; H01L23/13 ; H01L23/552 ; H01L23/66 ; H01L21/48 ; H01L23/00 ; H01L21/56 ; H01L23/31 ; H01Q9/04 ; H01Q1/52 ; H01L21/683 ; H01L25/16 ; H01L23/50

Abstract:
An antenna module includes: an integrated circuit (IC) configured to generate a radio frequency (RF) signal; and a substrate including an antenna portion providing a first surface of the substrate, and a circuit pattern portion providing a second surface of the substrate. The antenna portion includes first antenna members configured to transmit the RF signal, cavities corresponding to the first antenna members, through vias respectively disposed in the cavities and respectively electrically connected to the first antenna members, and a plating member disposed in at least one cavity among the cavities. The circuit pattern portion includes a circuit pattern and an insulating layer forming, for each of the through vias, an electrical connection path to the IC.
Public/Granted literature
- US20190036232A1 ANTENNA MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-01-31
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