Invention Grant
- Patent Title: Solar cell via thin film solder bond
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Application No.: US16405545Application Date: 2019-05-07
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Publication No.: US10971647B2Publication Date: 2021-04-06
- Inventor: Anthony Lochtefeld , Allen Barnett
- Applicant: AmberWave, Inc.
- Applicant Address: US NH Salem
- Assignee: AmberWave, Inc.
- Current Assignee: AmberWave, Inc.
- Current Assignee Address: US NH Salem
- Agent Harry Andrew Hild, Jr., Esq.
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/068 ; H01L31/047 ; H01L31/05 ; H01L31/048 ; H01L23/00

Abstract:
A method of forming a solar cell device that includes forming a porous layer in a monocrystalline donor substrate and forming an epitaxial semiconductor layer on the porous layer. A solar cell structure is formed on the epitaxial semiconductor layer. A carrier substrate is bonded to the solar cell structure through a bonding layer. The monocrystalline donor substrate is removed by cleaving the porous layer. A grid of metal contacts is formed on the epitaxial semiconductor layer. The exposed portions of the epitaxial semiconductor layer are removed. The exposed surface of the solar cell structure is textured. The textured surface may be passivated, in which the passivated surface can provide an anti-reflective coating.
Public/Granted literature
- US20190341512A1 SOLAR CELL VIA THIN FILM SOLDER BOND Public/Granted day:2019-11-07
Information query
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