Invention Grant
- Patent Title: High power performance gallium nitride high electron mobility transistor with ledges and field plates
-
Application No.: US16058388Application Date: 2018-08-08
-
Publication No.: US10971615B2Publication Date: 2021-04-06
- Inventor: Gengming Tao , Bin Yang , Xia Li
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/778 ; H01L29/06 ; H01L29/66

Abstract:
Certain aspects of the present disclosure provide a high electron mobility transistor (HEMT). The HEMT generally includes a gallium nitride (GaN) layer and an aluminum gallium nitride (AlGaN) layer disposed above the GaN layer. The HEMT also includes a source electrode, a gate electrode, and a drain electrode disposed above the AlGaN layer. The HEMT further includes n-doped protuberance(s) disposed above the AlGaN layer and disposed between at least one of: the gate electrode and the drain electrode; or the source electrode and the gate electrode. Each of the n-doped protuberances is separated from the gate electrode, the drain electrode, and the source electrode.
Public/Granted literature
- US20200052103A1 HIGH POWER PERFORMANCE GALLIUM NITRIDE HIGH ELECTRON MOBILITY TRANSISTOR WITH LEDGES AND FIELD PLATES Public/Granted day:2020-02-13
Information query
IPC分类: