Invention Grant
- Patent Title: Integrated devices in semiconductor packages and methods of forming same
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Application No.: US16511245Application Date: 2019-07-15
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Publication No.: US10971460B2Publication Date: 2021-04-06
- Inventor: Chen-Hua Yu , Kai-Chiang Wu , Chung-Shi Liu , Shou Zen Chang , Chao-Wen Shih
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/538 ; H01L23/00 ; H01L21/56 ; H01L21/48 ; H01L21/78 ; H01L23/552 ; H01L25/10 ; H01L25/00 ; H01P3/00 ; H01Q1/22 ; H01Q1/38 ; H01L23/31 ; H01Q9/04 ; H01L21/683 ; H01Q21/06
Abstract:
An embodiment package comprises an integrated circuit die encapsulated in an encapsulant, a patch antenna over the integrated circuit die, and a dielectric feature disposed between the integrated circuit die and the patch antenna. The patch antenna overlaps the integrated circuit die in a top-down view. The thickness of the dielectric feature is in accordance with an operating bandwidth of the patch antenna.
Public/Granted literature
- US20190341363A1 Integrated Devices in Semiconductor Packages and Methods of Forming Same Public/Granted day:2019-11-07
Information query
IPC分类:
