- Patent Title: Semiconductor device including bonding pad and bond wire or clip
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Application No.: US16296392Application Date: 2019-03-08
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Publication No.: US10971435B2Publication Date: 2021-04-06
- Inventor: Anton Mauder , Hans-Joachim Schulze
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102018105462.9 20180309
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H01L23/31 ; H01L33/62 ; H01L23/495 ; H01L23/00 ; H01L21/48 ; H01L29/861 ; H01L29/78 ; H01L29/40 ; H01L29/417 ; H01L29/739
Abstract:
A semiconductor device includes a bonding pad that includes a base portion having a base layer. A bond wire or clip is bonded to a bonding region of a main surface of the bonding pad. A supplemental structure is in direct contact with the base portion next to the bonding region. A specific heat capacity of the supplemental structure is higher than a specific heat capacity of the base layer.
Public/Granted literature
- US20190279922A1 Semiconductor Device Including Bonding Pad and Bond Wire or Clip Public/Granted day:2019-09-12
Information query
IPC分类:
