Invention Grant
- Patent Title: Systems and methods for precision fabrication of an orifice within an integrated circuit
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Application No.: US16593831Application Date: 2019-10-04
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Publication No.: US10971401B2Publication Date: 2021-04-06
- Inventor: Jean-Philippe Fricker
- Applicant: Cerebras Systems Inc.
- Applicant Address: US CA Los Altos
- Assignee: Cerebras Systems Inc.
- Current Assignee: Cerebras Systems Inc.
- Current Assignee Address: US CA Los Altos
- Agent Jeffrey Schox
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/304 ; H01L21/306 ; H01L21/02 ; H01L21/04 ; H01L21/768 ; B23K26/384 ; H01L21/3065 ; H01L21/3105
Abstract:
A method for fabricating an orifice in a semiconductor which can include: removing a first depth of the semiconductor using a first material removal technique and removing a second depth of the semiconductor using a second material removal technique. The method can optionally include: adding a sacrificial layer of material and reducing a depth of the semiconductor by a friction-based material removal technique. In examples, the method fabricates a wafer-scale processor with a set of fastening features.
Information query
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