Invention Grant
- Patent Title: Printed circuit board with protective member and method of manufacturing semiconductor package having the same
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Application No.: US16044718Application Date: 2018-07-25
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Publication No.: US10971376B2Publication Date: 2021-04-06
- Inventor: Jae Seon Hwang , Hyeong Gi Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2018-0004994 20180115
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/683 ; H01L21/56 ; H01L23/498 ; H01L23/31 ; H01L23/00
Abstract:
A method of manufacturing a semiconductor package includes providing a substrate main body to which external connection terminals are attached, attaching a protective member to the substrate main body to cover the external connection terminals, mounting a semiconductor chip on a surface of the substrate main body that is opposite from the protective member, and removing the protective member from the substrate main body.
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