Invention Grant
- Patent Title: Modular applications using a common provisioning service
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Application No.: US15639375Application Date: 2017-06-30
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Publication No.: US10970138B2Publication Date: 2021-04-06
- Inventor: Elio Damaggio , Chipalo Street , Eustace Ngwa Asanghanwa , Angelo Roncalli de Novaes Pires Ribeiro , Damon Luke Barry , Arjmand Samuel , Michael R. Yagley
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Agency: Chin IP, PLLC
- Agent David Chin
- Main IPC: G06F15/173
- IPC: G06F15/173 ; G06F9/54 ; H04L29/08 ; H04L12/24 ; G06F16/27 ; G06F8/654 ; H04W12/00 ; G06N5/04 ; G06F8/60 ; H04L29/06 ; G06N20/00 ; H04W4/70 ; G06N3/02 ; G06F8/61 ; G06F9/44

Abstract:
The disclosed technology is generally directed to IoT technology. In one example of the technology, the following actions are performed for each module of a plurality of modules on a first edge device. An identification message that includes information associated with identification of the module is received. The validity of the module is then verified. After the module is verified, based at least in part on the identification message, an IoT support service is selected from a plurality of IoT support services. The module is then caused to be registered with the selected IoT support service. The plurality of modules are compositable together into an application for the first edge device. The modules of the plurality of modules are capable of being used interoperably with other modules without altering the other modules.
Public/Granted literature
- US20180331916A1 MODULAR APPLICATIONS USING A COMMON PROVISIONING SERVICE Public/Granted day:2018-11-15
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