Invention Grant
- Patent Title: Extreme ultraviolet lithography apparatus
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Application No.: US16711593Application Date: 2019-12-12
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Publication No.: US10969702B2Publication Date: 2021-04-06
- Inventor: Eokbong Kim , Mun ja Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2019-0081136 20190705
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F1/62 ; G02B5/08 ; G03F1/24 ; G02B5/20

Abstract:
An EUV lithography apparatus may include a light source, an EUV mask and a carbon-based optical filter. The light source may generate an EUV light. The EUV mask may be configured to apply the EUV light to a photoresist film on a substrate. The carbon-based optical filter may filter a light having an OoB wavelength in the EUV light. Thus, the EUV light may not include the light having the OoB wavelength to decrease an error of a photoresist pattern formed using the EUV light.
Public/Granted literature
- US20210003929A1 EXTREME ULTRAVIOLET LITHOGRAPHY APPARATUS Public/Granted day:2021-01-07
Information query
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