Invention Grant
- Patent Title: High yield strength, low thermal impedance component and manufacturing method
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Application No.: US15347558Application Date: 2016-11-09
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Publication No.: US10967550B2Publication Date: 2021-04-06
- Inventor: Bradley Yearous , Barry J Lee
- Applicant: Plantronics, Inc.
- Applicant Address: US CA Santa Cruz
- Assignee: Plantronics, Inc.
- Current Assignee: Plantronics, Inc.
- Current Assignee Address: US CA Santa Cruz
- Agency: Haynes Beffel & Wolfeld LLP
- Agent Mark A. Haynes
- Main IPC: B29C45/73
- IPC: B29C45/73 ; B33Y10/00 ; B33Y40/00 ; B33Y80/00 ; B23K26/342 ; B23K26/00 ; B23P15/00 ; B23K103/04 ; B23K103/12 ; B23K103/16 ; B23K101/12

Abstract:
A machine component is formed of a coalesced metal body of multiple zones of material having at least one high hardness surface, along with high yield strength and good thermal conductivity. The coalesced metal body can have a zone of steel and a zone of copper, and have a transition zone in which the zones of steel and copper coalesce. The coalesced metal body has a machined surface on the zone of steel on a first side of the coalesced metal body. The zone of copper has a proximal boundary disposed proximal to, and separated by, the zone of steel, from the machined surface. Also the zone of copper has a distal boundary distal to the machined surface and proximal to a second surface of the coalesced metal body.
Public/Granted literature
- US20180126615A1 High Yield Strength, Low Thermal Impedance Component and Manufacturing Method Public/Granted day:2018-05-10
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