Invention Grant
- Patent Title: Neckband headset with noise rejection
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Application No.: US16533641Application Date: 2019-08-06
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Publication No.: US10945063B2Publication Date: 2021-03-09
- Inventor: Cheng Liu , John A Kelley , Wen Song , John S. Graham
- Applicant: Plantronics, Inc.
- Applicant Address: US CA Santa Cruz
- Assignee: Plantronics, Inc.
- Current Assignee: Plantronics, Inc.
- Current Assignee Address: US CA Santa Cruz
- Agency: Ferguson Braswell Fraser Kubasta PC
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R1/08 ; G10L21/0232 ; H04R3/00 ; G06F3/16 ; H04R1/40

Abstract:
A communication headset includes a neckband with a horseshoe-shaped footprint and two microphone tips disposed at two ends of the neckband, the two ends establishing an aperture of the horseshoe-shaped footprint. Each of the two microphone tips includes a slanted base. The communication headset further includes a microphone array including two sets of microphones in a spatial configuration in which the two sets of microphones are disposed on the slanted bases of the two microphone tips. An effective acoustic spacing between the microphones in the microphone array is at least 15 mm.
Public/Granted literature
- US20210044889A1 Neckband Headset with Noise Rejection Public/Granted day:2021-02-11
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