Invention Grant
- Patent Title: Invisible headliner microphone
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Application No.: US16671966Application Date: 2019-11-01
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Publication No.: US10945060B2Publication Date: 2021-03-09
- Inventor: Marco Salvatore Riemann , Darin Krajewski , Viktor Dobos , Zoltan Giang-Son Kleinheincz , Florian Czinege
- Applicant: Harman Becker Automotive Systems GmbH
- Applicant Address: DE Karlsbad
- Assignee: Harman Becker Automotive Systems GmbH
- Current Assignee: Harman Becker Automotive Systems GmbH
- Current Assignee Address: DE Karlsbad
- Agency: Brooks Kushman P.C.
- Main IPC: H04R3/00
- IPC: H04R3/00 ; H04R17/02 ; H04R1/08 ; B60R11/02 ; B60R11/00

Abstract:
A microphone assembly includes a printed circuit board that defines a tab that is configured to extend into an opening defined by a substrate layer of a headliner. The microphone assembly includes a microphone element mounted on the tab. The microphone assembly includes a sealing element that surrounds the tab and the microphone element and is configured to fill the opening and define an air path from a cabin side of the substrate layer to the printed circuit board or the microphone element.
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