Invention Grant
- Patent Title: Thermally activated memristors, fabricating methods and applications of same
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Application No.: US16508464Application Date: 2019-07-11
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Publication No.: US10944047B2Publication Date: 2021-03-09
- Inventor: Mark C. Hersam , Vinod K. Sangwan
- Applicant: NORTHWESTERN UNIVERSITY
- Applicant Address: US IL Evanston
- Assignee: NORTHWESTERN UNIVERSITY
- Current Assignee: NORTHWESTERN UNIVERSITY
- Current Assignee Address: US IL Evanston
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Main IPC: H01L43/08
- IPC: H01L43/08 ; H01L43/02 ; H01L43/10 ; H01L43/12

Abstract:
Thermally activated memristors from solution-processed two-dimensional (2D) semiconductors, fabricating methods and applications of the same. The memristor includes a semiconductor film formed on a nanoporous membrane, and at least two electrodes spatial-apart formed on the semiconductor film and electrically coupled with the semiconductor film to define a channel in the semiconductor film between the at least two electrodes, where the channel has one or more filaments, one or more dendrite, or a combination of them formed in the semiconductor film. The underlying switching mechanism applies generally to a range of 2D semiconductors including, but not limited to, MoS2, MoSe2, WS2, ReS2, InSe, or related 2D semiconductor materials.
Public/Granted literature
- US20200083440A1 THERMALLY ACTIVATED MEMRISTORS, FABRICATING METHODS AND APPLICATIONS OF SAME Public/Granted day:2020-03-12
Information query
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