Invention Grant
- Patent Title: Resin package and light-emitting device
-
Application No.: US16773434Application Date: 2020-01-27
-
Publication No.: US10944035B2Publication Date: 2021-03-09
- Inventor: Yuta Horikawa , Takuya Miki , Shoichi Ishikawa , Ryosuke Wakaki
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Foley & Lardner LLP
- Priority: JP2017-228484 20171129
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/48 ; H01L25/07 ; H01L25/075 ; H01L23/495 ; H01L23/498

Abstract:
A light-emitting device includes: a resin package including: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion; and a first light-emitting element and a second light-emitting element that are disposed in the recess.
Public/Granted literature
- US20200161523A1 RESIN PACKAGE AND LIGHT-EMITTING DEVICE Public/Granted day:2020-05-21
Information query
IPC分类: