Invention Grant
- Patent Title: Light-receiving element, method of manufacturing light-receiving element, imaging device, and electronic apparatus
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Application No.: US16655647Application Date: 2019-10-17
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Publication No.: US10943932B2Publication Date: 2021-03-09
- Inventor: Shinichi Yoshida , Shunsuke Maruyama , Ryosuke Matsumoto , Shuji Manda , Tomomasa Watanabe
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JPJP2015-242235 20151211
- Main IPC: H01L31/0224
- IPC: H01L31/0224 ; H01L27/144 ; H01L27/146 ; H01L31/103 ; H01L31/0216 ; H04N5/33 ; H04N5/369 ; H01L31/102

Abstract:
This light-receiving element includes: a substrate; a photoelectric conversion layer that is provided on the substrate and includes a first compound semiconductor, and absorbs a wavelength in an infrared region to generate electric charges; a semiconductor layer that is provided on the photoelectric conversion layer and includes a second compound semiconductor, and has an opening in a selective region; and an electrode that buries the opening of the semiconductor layer and is electrically coupled to the photoelectric conversion layer.
Public/Granted literature
Information query
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