Invention Grant
- Patent Title: Method of manufacturing an electronic device and electronic device manufactured thereby
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Application No.: US16827068Application Date: 2020-03-23
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Publication No.: US10943884B2Publication Date: 2021-03-09
- Inventor: Hwan Kyu Kim , Dae Gon Kim , Tae Kyeong Hwang , Ji Young Chung , Kwangmo Chris Lim
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Valley Point
- Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee Address: SG Valley Point
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L23/00 ; H01L23/498
Abstract:
Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.
Public/Granted literature
- US20200227378A1 METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURED THEREBY Public/Granted day:2020-07-16
Information query
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