Invention Grant
- Patent Title: Method for dicing die attach film
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Application No.: US16358017Application Date: 2019-03-19
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Publication No.: US10943825B2Publication Date: 2021-03-09
- Inventor: Marco Notarianni , Leslie Michael Lea , Russell Westerman
- Applicant: Plasma-Therm LLC
- Applicant Address: US FL St. Petersburg
- Assignee: Plasma-Therm LLC
- Current Assignee: Plasma-Therm LLC
- Current Assignee Address: US FL St. Petersburg
- Agency: Burr & Forman LLP
- Agent Harvey S. Kauget
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/683 ; H01L21/3065
Abstract:
The present invention provides a method for dicing a substrate on a composite film. A work piece having a support film, a frame and a substrate is provided. The substrate has a top surface and a bottom surface. The top surface of the substrate has at least one die region and at least one street region. The composite film is interposed between the substrate and the support film. Substrate material is etched from the at least one street region to expose a portion of the composite film using a substrate etch process. A first component of the composite film is etched using a first etch process. A second component of the exposed portion of the composite film is plasma etched using a second etch process.
Public/Granted literature
- US20200083084A1 Method for Dicing Die Attach Film Public/Granted day:2020-03-12
Information query
IPC分类:
