Invention Grant
- Patent Title: Sputtering arrangement and sputtering method for optimized distribution of the energy flow
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Application No.: US15775827Application Date: 2016-11-14
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Publication No.: US10943774B2Publication Date: 2021-03-09
- Inventor: Siegfried Krassnitzer , Daniel Lendi , Denis Kurapov
- Applicant: Oerlikon Surface Solutions AG, Pfäffikon
- Applicant Address: CH Pfäffikon
- Assignee: Oerlikon Surface Solutions AG, Pfäffikon
- Current Assignee: Oerlikon Surface Solutions AG, Pfäffikon
- Current Assignee Address: CH Pfäffikon
- Agency: Polson Intellectual Property Law, PC
- Agent Margaret Polson; Christopher Sylvain
- International Application: PCT/EP2016/001891 WO 20161114
- International Announcement: WO2017/080672 WO 20170518
- Main IPC: H01J37/34
- IPC: H01J37/34 ; C23C14/34

Abstract:
The present disclosure relates to a sputtering arrangement, a vacuum coating system, and a method for carrying out HiPIMS coating methods; the sputtering arrangement has at least two different interconnection possibilities and the switch to the second interconnection possibility, in which two sputtering sub-assemblies are operated simultaneously with high power pulses, achieves a productivity gain.
Public/Granted literature
- US20180330931A1 Sputtering Arrangement and Sputtering Method for Optimized Distribution of the Energy Flow Public/Granted day:2018-11-15
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