A method of manufacturing a multilayer ceramic electronic component which includes preparing first and second ceramic green sheets; forming an internal electrode pattern on the first ceramic green sheet using a conductive metal paste; forming a ceramic member on first and second end portions of a first surface of the second ceramic green sheet to form a step portion absorption layer; stacking two or more of the first ceramic green sheets on each other in a stacking direction to form a first group; stacking two or more of the first ceramic green sheets on each other in the stacking direction to form a second group; and placing the second ceramic green sheet between the first group and the second group in the stacking direction to form a ceramic body, wherein the first and second end portions oppose each other in a first direction perpendicular to the stacking direction.