Optical control modules for integrated circuit device patterning and reticles and methods including the same. The methods include exposing, via a reticle, initial and subsequent reticle exposure fields on a surface of a semiconductor substrate. The initial and subsequent reticle exposure fields pattern corresponding array regions and margin regions on the semiconductor substrate. The initial and subsequent reticle exposure fields partially overlap such that an initial optical control module (OCM), which is patterned during exposure of the initial reticle exposure field, and a subsequent OCM, which is patterned during exposure of the subsequent reticle exposure field, both are positioned within a single control module die. The reticles include reticles that can be utilized during the methods or that can form the integrated circuit devices. The integrated circuit devices include integrated circuit devices formed utilizing the methods or the reticles.