Invention Grant
- Patent Title: Mask blank, phase shift mask, and method for manufacturing semiconductor device
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Application No.: US16596008Application Date: 2019-10-08
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Publication No.: US10942441B2Publication Date: 2021-03-09
- Inventor: Osamu Nozawa , Takenori Kajiwara , Hiroaki Shishido
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JPJP2015-193314 20150930
- Main IPC: G03F1/32
- IPC: G03F1/32 ; G03F1/54

Abstract:
A mask blank having a phase shift film and a light shielding film laminated on a transparent substrate. The phase shift film transmits ArF exposure light at a transmittance of from 2% to 30% and generates a phase difference of from 150° to 200°, is formed from a material containing Si and not substantially containing Cr, and has a lower layer (L) and an upper layer (U) laminated from the transparent substrate side. A refractive index n for layer L is below that of the substrate while n for layer U is higher, and layer L has an extinction coefficient k higher than that of layer U. The light shielding film includes a layer in contact with the phase shift film that is formed from a material containing Cr, has a n lower than that of layer U, and has an extinction coefficient k higher than that of layer U.
Public/Granted literature
- US20200033718A1 MASK BLANK, PHASE SHIFT MASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2020-01-30
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