Invention Grant
- Patent Title: Film formation method
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Application No.: US16307418Application Date: 2017-04-27
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Publication No.: US10941493B2Publication Date: 2021-03-09
- Inventor: Katsuhisa Tanabe , Tatsushi Someya , Naoshi Nishimura , Tetsuya Sasamura , Eriko Furuya
- Applicant: C. Uyemura & Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: C. Uyemura & Co., Ltd.
- Current Assignee: C. Uyemura & Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Alston & Bird LLP
- Priority: JPJP2016-116993 20160613
- International Application: PCT/JP2017/016793 WO 20170427
- International Announcement: WO2017/217125 WO 20171221
- Main IPC: C23C18/44
- IPC: C23C18/44 ; C23C18/16 ; C23C18/18 ; C23C18/54 ; H01L21/288
Abstract:
A film formation method is provided with a catalyst film formation step for forming a catalyst film on the surface of a substrate by displacement reduction plating, an intermediate film formation step for forming a palladium plating film on the catalyst film, and a surface film formation step for forming a gold plating film on the palladium plating film.
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