Invention Grant
- Patent Title: Memory array and a method used in forming a memory array
-
Application No.: US16179572Application Date: 2018-11-02
-
Publication No.: US10937798B2Publication Date: 2021-03-02
- Inventor: Changhan Kim , Richard J. Hill , John D. Hopkins , Collin Howder
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11524 ; H01L27/1157 ; H01L27/11556 ; H01L21/28

Abstract:
A memory array comprises a vertical stack comprising alternating insulative tiers and wordline tiers. The wordline tiers comprise gate regions of individual memory cells. The gate regions individually comprise part of a wordline in individual of the wordline tiers. Channel material extends elevationally through the insulative tiers and the wordline tiers. The individual memory cells comprise a memory structure laterally between the gate region and the channel material. Individual of the wordlines comprise opposing laterally-outer longitudinal edges. The longitudinal edges individually comprise a longitudinally-elongated recess extending laterally into the respective individual wordline. Methods are disclosed.
Information query
IPC分类: