- Patent Title: Semiconductor device package and method for manufacturing the same
-
Application No.: US16709623Application Date: 2019-12-10
-
Publication No.: US10937761B2Publication Date: 2021-03-02
- Inventor: Chih-Ming Hung , Meng-Jen Wang , Tsung-Yueh Tsai , Jen-Kai Ou
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L27/146 ; H01L23/544 ; H01L23/31 ; H01L21/56 ; G06K9/00
Abstract:
A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
Information query
IPC分类:
