Invention Grant
- Patent Title: Semiconductor module and method for manufacturing semiconductor module
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Application No.: US16362120Application Date: 2019-03-22
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Publication No.: US10937727B2Publication Date: 2021-03-02
- Inventor: Yuhei Nishida
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Priority: JPJP2018-88148 20180501
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/00
Abstract:
A semiconductor module includes a metal plate; a solder applied on the metal plate; a component-to-be-bonded mounted on the solder; and a linear guide portion delineated along a circumference of the component-to-be-bonded on a top surface of the metal plate, and including a metal surface having greater surface roughness than a peripheral region.
Public/Granted literature
- US20190341345A1 SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE Public/Granted day:2019-11-07
Information query
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