Invention Grant
- Patent Title: Conductive polyamide resin composition
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Application No.: US16483845Application Date: 2018-02-06
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Publication No.: US10934432B2Publication Date: 2021-03-02
- Inventor: Shuji Kubota , Nobuhiro Yoshimura , Yuhei Fukumoto , Kazuki Iwamura , Kiyofumi Sakai , Osamu Mabuchi
- Applicant: TOYOBO CO., LTD.
- Applicant Address: JP Osaka
- Assignee: TOYOBO CO., LTD.
- Current Assignee: TOYOBO CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2017-020190 20170207
- International Application: PCT/JP2018/003926 WO 20180206
- International Announcement: WO2018/147250 WO 20180816
- Main IPC: H01B1/24
- IPC: H01B1/24 ; C08L77/00 ; C08K3/04 ; C08L23/06 ; C08L23/08 ; C08L23/26

Abstract:
Disclosed is a conductive polyamide resin composition that excels not only in electroconductivity, but also in fuel resistance, particularly resistance against alcohol-containing fuel, and further excels in fluidity and moldability, and is capable of yielding a molded article with high impact resistance, the conductive polyamide resin composition including: 84 to 40% by mass of a polyamide resin (A); 5 to 30% by mass of conductive carbon black (B); 3 to 30% by mass of an ethylene-α-olefin copolymer (C) that has a reactive functional group capable of reacting with a terminal group of polyamide resin and/or an amido group on a principal chain of polyamide resin; and 1 to 20% by mass of a conductive polyethylene resin (D).
Public/Granted literature
- US20200010678A1 CONDUCTIVE POLYAMIDE RESIN COMPOSITION Public/Granted day:2020-01-09
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