Invention Grant
- Patent Title: Solder paste containing solder powder and flux
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Application No.: US15576539Application Date: 2016-10-25
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Publication No.: US10933495B2Publication Date: 2021-03-02
- Inventor: Motohide Sasaki , Takeshi Yahagi , Noriyoshi Uchida
- Applicant: KOKI Company Limited
- Applicant Address: JP Tokyo
- Assignee: KOKI Company Limited
- Current Assignee: KOKI Company Limited
- Current Assignee Address: JP Tokyo
- Agency: Clark & Brody LP
- Priority: JP2015-209954 20151026
- International Application: PCT/JP2016/081621 WO 20161025
- International Announcement: WO2017/073575 WO 20170504
- Main IPC: B23K35/36
- IPC: B23K35/36 ; B23K35/02 ; B23K35/362 ; B23K35/26
Abstract:
Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.
Public/Granted literature
- US20180147675A1 Flux and Solder Composition Public/Granted day:2018-05-31
Information query
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