Invention Grant
- Patent Title: Metal sublayer sensing in multi-layer workpiece hole drilling
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Application No.: US16067715Application Date: 2016-12-22
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Publication No.: US10933490B2Publication Date: 2021-03-02
- Inventor: Guy Soffer
- Applicant: Drilliant Ltd.
- Applicant Address: IL Kiryat Ono
- Assignee: Drilliant Ltd.
- Current Assignee: Drilliant Ltd.
- Current Assignee Address: IL Kiryat Ono
- Agency: Browdy and Neimark, P.L.L.C.
- International Application: PCT/IL2016/051376 WO 20161222
- International Announcement: WO2017/109787 WO 20170629
- Main IPC: B23K15/08
- IPC: B23K15/08 ; B23K26/12 ; B23K26/16 ; B23K26/36 ; B23K26/03 ; H05K3/00 ; B23K26/382

Abstract:
Disclosed herein is a method of drilling in a multilayer printed circuit board. The method includes drilling a one hole; directing electromagnetic radiation having at least one wavelength with higher energy than a work-function the metal layer toward the hole, and thus causing the metal layer to emit free electrons; and measuring the quantity or intensity of electrically charged particles derived from the emitted free electrons, to detect the extent of exposure or disappearance of the metal layer during drilling.
Public/Granted literature
- US20190009359A1 Metal Sublayer Sensing In Multi-Layer Workpiece Hole Drilling Public/Granted day:2019-01-10
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