Invention Grant
- Patent Title: Electronic component, power supply device, and method of manufacturing coil
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Application No.: US16342767Application Date: 2017-09-08
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Publication No.: US10917971B2Publication Date: 2021-02-09
- Inventor: Hirofumi Nakazawa
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2016-224259 20161117
- International Application: PCT/JP2017/032502 WO 20170908
- International Announcement: WO2018/092392 WO 20180524
- Main IPC: H01F27/24
- IPC: H01F27/24 ; H05K1/18 ; H01F27/28 ; H01F27/29 ; H01F27/32 ; H01F41/02 ; H01F30/10 ; H01F27/255 ; H01F41/12
Abstract:
Provided is an electronic component including a coil portion including a base including a conductive metal, and a terminal portion that is connected to a predetermined circuit board. A front surface of the base is covered, and the terminal portion is exposed.
Public/Granted literature
- US20190269015A1 ELECTRONIC COMPONENT, POWER SUPPLY DEVICE, AND METHOD OF MANUFACTURING COIL Public/Granted day:2019-08-29
Information query
