Invention Grant
- Patent Title: Primer composition and copper foil substrate using the same
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Application No.: US16057779Application Date: 2018-08-07
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Publication No.: US10917964B2Publication Date: 2021-02-09
- Inventor: Shi-Ing Huang , Jui-Hsiang Tang
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW107113094A 20180417
- Main IPC: H05K1/02
- IPC: H05K1/02 ; B32B15/085 ; B32B15/20 ; C09D4/06 ; C09D147/00 ; C09D171/12 ; H05K3/02 ; B32B27/32 ; C09D5/00 ; C09D183/04 ; C08J7/04 ; H05K1/09 ; C09D7/65 ; C08G77/20 ; C09D183/06 ; C08J5/24
Abstract:
A primer composition and a copper foil substrate using the same are provided. The primer composition includes a mixture of a hydrocarbon resin and a compound having three or more carbon-carbon double bonds, wherein a molar ratio of the hydrocarbon resin to the compound having three or more carbon-carbon double bonds is 1:0.2 to 1:10.
Public/Granted literature
- US20190053367A1 PRIMER COMPOSITION AND COPPER FOIL SUBSTRATE USING THE SAME Public/Granted day:2019-02-14
Information query
